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US Patent 10388875 Separation method, light-emitting device, module, and electronic device
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Patent
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Date Filed
October 10, 2017
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Date of Patent
August 20, 2019
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Patent Application Number
15728575
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Patent Citations Received
US Patent 11587474 Flexible device array substrate and manufacturing method of flexible device array substrate
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US Patent 11777066 Flipchip interconnected light-emitting diode package assembly
Patent Inventor Names
Masataka Sato
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Toshiyuki Miyamoto
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Masafumi Nomura
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Seiji Yasumoto
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10388875
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Patent Primary Examiner
Peniel M Gumedzoe
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