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US Patent 10395984 Self-aligned via interconnect structures
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Patent
Date Filed
March 15, 2016
Date of Patent
August 27, 2019
Patent Application Number
15070242
Patent Citations Received
US Patent 12094966 Silicon carbide semiconductor device
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US Patent 10636737 Structure and method of metal wraparound for low via resistance
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US Patent 11239418 Memory device having a ring heater
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US Patent 10872856 Semiconductor device including through vias in molded columns
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US Patent 11970776 Atomic layer deposition of metal films
0
US Patent 12074029 Molybdenum deposition
0
Patent Inventor Names
Brian A. Cohen
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Benjamin C. Backes
0
Carl J. Radens
0
Joyeeta Nag
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10395984
Patent Primary Examiner
David A Zarneke
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