US Patent 10396753 Stacked wafer-level packaging devices
Patent 10396753 was granted and assigned to Skyworks Solutions, Inc. on August, 2019 by the United States Patent and Trademark Office.
Is a
Date Filed
May 22, 2017
0
Date of Patent
August 27, 2019
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Patent Application Number
15602008
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Patent Inventor Names
Russ Alan Reisner
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John C. Baldwin
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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