Patent attributes
A system for electrically coupling a garment to a mating object and manufacture method thereof, the system comprising: a fabric interlayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and including a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and including a set of holes aligned with the set of vias and the set of ports, as well as a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that 1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of ports, the set of vias, and the set of holes in supporting a waterproof seal, and 2) electrically couple the set of embedded ports to the set of vias.
