US Patent 10399231 Substrate handling contacts and methods

A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface and a plurality of contact structures. At least one contact structure of the plurality of contact structures is located at the edge and at least one contact structure of the plurality of contact structures is located on the planar surface. The substrate reception area and planar surface are made of a first material. Each contact structure of the plurality of contact structures includes a second material different from the first material, the second material having a hardness aligned to a hardness of a substrate material.