US Patent 10405428 Electronic device and manufacturing method thereof

According to one embodiment, an electronic device includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement which is disposed to be apart from the first conductive layer and includes a first surface opposed to the first conductive layer and a second surface opposite to the first surface, and a second conductive layer disposed on the second surface, the second substrate including a first hole passing through the second basement, and a connecting material passing through the first hole to electrically connect the first conductive layer and the second conductive layer, wherein the first hole is shaped as a funnel.