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US Patent 10410857 Formation of SiN thin films
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Patent
Date Filed
August 24, 2015
Date of Patent
September 10, 2019
Patent Application Number
14834290
Patent Citations Received
US Patent 11979171 Reduced complexity encoders and related systems, methods, and devices
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US Patent 10580645 Plasma enhanced atomic layer deposition (PEALD) of SiN using silicon-hydrohalide precursors
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US Patent 11551926 Methods of forming a microelectronic device, and related systems and additional methods
US Patent 11587783 Si precursors for deposition of SiN at low temperatures
US Patent 11069522 Si precursors for deposition of SiN at low temperatures
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US Patent 11289327 Si precursors for deposition of SiN at low temperatures
US Patent 11694890 Substrate processing method and substrate processing apparatus
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US Patent 11784043 Formation of SiN thin films
US Patent 11367613 Deposition of SiN
Patent Inventor Names
Dai Ishikawa
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Shang Chen
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Toshiya Suzuki
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Viljami J. Pore
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Kunitoshi Namba
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Ryoko Yamada
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Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10410857
Patent Primary Examiner
Frederick B Hargrove
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