Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 10, 2019
Patent Application Number
14985839
Date Filed
December 31, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic package apparatus is formed from a semiconductor substrate having a cavity formed therein. The cavity has a top surface, a bottom surface and a sidewall surface, and a spacer extending from the bottom surface to the top surface. The spacer is formed from a dielectric material and has at least one lateral dimension less than 0.1 cm.
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