Patent attributes
A wiring substrate includes a substrate body, a first wiring, and a second wiring. The first wiring and the second wiring are located on an upper surface of the substrate body. The wiring substrate further includes a solder resist layer that covers the first wiring and the second wiring. The solder resist layer includes a first opening that partially exposes the second wiring and a missing portion that partially exposes the first wiring. The wiring substrate further includes an insulation coating that covers an inner wall of the missing portion, the first wiring exposed by the missing portion, and at least a portion of an upper surface of the solder resist layer. The insulation coating includes a second opening that is in communication with the first opening and partially exposes the second wiring.
