US Patent 10418396 Stacked image sensor package
All edits
Edits on 9 Dec, 2023
Golden AI
Edits made to:
Article (+374 characters)
Article
Patent abstract
Implementations of semiconductor packages may include: an image sensor; an optically transmissive transparent coating directly coupled to the image sensor; and a glass lid coupled directly coupled to the optically transmissive coating. An entire surface of the glass may be directly coupled to an entire surface of the optically transmissive adhesive coating.
Edits on 2 Oct, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Inventor Names
Weng-Jin Wu0
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 27 Mar, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
104183960
Date of Patent
September 17, 2019
0Patent Application Number
159446340
Date Filed
April 3, 2018
0Official Website
Patent Citations Received
Patent Primary Examiner
Edits on 22 Mar, 2023
Golden AI
Infobox
Patent Citations Received
Edits on 25 Sep, 2022
Golden AI
Infobox
Patent Citations Received
Edits on 29 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
Edits on 18 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 16 Mar, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
Edits on 28 Jan, 2022
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 10418396 Stacked image sensor package
Infobox
Is a
Patent jurisdiction
Patent number
10418396
Date of patent
September 17, 2019
Patent application number
15944634
Date Filed
April 3, 2018
Patent primary examiner
Find more entities like US Patent 10418396 Stacked image sensor package
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
