Patent attributes
A laminated busbar assembly includes a substrate, a positive current metal plate provided with a first pin, a negative current metal plate provided with a second pin, and an output current metal plate provided with a third pin. The substrate is provided with a pad hole group including a first pad hole, a second pad hole, and a third pad hole. The pad hole group is electrically connected to copper cladded on the substrate to form wirings. The positive current metal plate, the negative current metal plate, and the output current metal plate re all arranged on the first side of the substrate in a laminated manner. The first pin passes through first pad hole, the second pin passes through the second pad hole, and the third pin passes through the third pad hole.
