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US Patent 10422831 Chip-to-chip signal transmission system and signal reception circuit

Patent 10422831 was granted and assigned to I-Shou University on September, 2019 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
I-Shou University
I-Shou University
Current Assignee
I-Shou University
I-Shou University
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10422831
Patent Inventor Names
Yu-Jung Huang0
Yan-Cen Liou0
Date of Patent
September 24, 2019
Patent Application Number
15451429
Date Filed
March 7, 2017
Patent Citations Received
‌
US Patent 11748545 Method and electronic device for configuring signal pads between three-dimensional stacked chips
Patent Primary Examiner
‌
Akm Zakaria
Patent abstract

The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal. The receiver receives the receiving-testing-coupling signal through the reception-metal-pad and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

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