Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Erick Merle Spory0
Date of Patent
October 1, 2019
0Patent Application Number
159542560
Date Filed
April 16, 2018
0Patent Primary Examiner
Patent abstract
A method is provided. The method includes one or more of securing a die into a cavity of a hermetic package base, providing one or more bond connections to the die, placing a hermetic package lid on the package base, and 3D printing, by a 3D printer, hermetic lid seal material to a joint between the hermetic package base and the hermetic package lid, at a temperature at or below 100 degrees Celsius.
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