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US Patent 10431614 Edge seals for semiconductor packages

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 1, 2017
Date of Patent
October 1, 2019
Patent Application Number
15421505
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
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US Patent 11929347 Mixed exposure for large die
0
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US Patent 11955445 Metal pads over TSV
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US Patent 12125784 Interconnect structures
0
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US Patent 11552041 Chemical mechanical polishing for hybrid bonding
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
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US Patent 11749645 TSV as pad
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US Patent 11756880 Interconnect structures
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US Patent 11804377 Method for preparing a surface for direct-bonding
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10431614
Patent Primary Examiner
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Mouloucoulaye Inoussa

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