US Patent 10442103 Device and method for processing substrates

A device for processing substrates uses a separation system. Processed substrates can be separated into one or more waste parts and at least one blank. Improved flexibility for treating substrates is provided. The separation system comprises a transport cylinder and a stripping cylinder associated therewith. The transport cylinder has first openings and has a detachably secured packing having depressions in which perforations are formed, with at least one perforation covering at least one first opening. The stripping cylinder has a detachably secured packing having raised areas that correspond to the depressions.