US Patent 10445554 Package structure of fingerprint identification chip

The present invention provides a package structure of a fingerprint identification chip, including: a substrate, having a first surface, a second surface and a penetrating opening, the second surface including a groove extending from the penetrating opening and a second metal contact, and the groove being used for accommodating a first metal contact; a fingerprint identification chip having an upper surface and a lower surface, the fingerprint identification being disposed in the penetrating opening and having a bonding pad on the lower surface; a cover plate, fixedly disposed on the first surface of the substrate and covering the upper surface of the fingerprint identification chip; and a flexible print circuit (FPC), disposed on the second surface of the substrate, a surface of the FPC having a third metal contact that corresponds to and is electrically connected to the second metal contact, where bonding pad is electrically connected to the first metal contact through a wire.