Patent attributes
An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, and an adhesive layer disposed on facing boundaries of the multilayer capacitor and the interposer; wherein the external terminals include bonding portions disposed on a top surface of the interposer body and connected to the external electrodes via the adhesive layer, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer body to connect the bonding portions and the mounting portions to each other; wherein 0.1≤t/T≤0.3 in which dimension “t” is a maximum height of the adhesive layer and dimension “T” is a height of the electronic component.
