US Patent 10446402 Semiconductor device

The present disclosure provides semiconductor devices and fabrication methods thereof. A work function layer is formed on the semiconductor substrate. A buffer layer is formed on the work function layer. The work function layer is doped through the buffer layer with impurity ions. The buffer layer obstructs a flow of the impurity ions to control a concentration of the impurity ions in different regions of the work function layer to regulate a work function of the work function layer in the different regions.