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US Patent 10449750 Surface adhesive for devices

Patent 10449750 was granted and assigned to Orthobond Corporation on October, 2019 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
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Orthobond Corporation
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Current Assignee
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Orthobond Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
104497500
Patent Inventor Names
Sam Hong0
Cheoljin Kim0
Jordan Katz0
Randy Clevenger0
Carlos Caicedo-Carvajal0
Date of Patent
October 22, 2019
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Patent Application Number
145914830
Date Filed
January 7, 2015
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Patent Citations Received
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US Patent 10876217 Electrochemical attachment of phosphonic acids to metallic substrates and osteoconductive medical devices containing same
Patent Primary Examiner
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Matthew D. Matzek
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Patent abstract

Disclosed in certain embodiments is a composition comprising a first material; an adhesive material attached to the first material; a plurality of linker molecules bonded to the adhesive material; and a second material bonded to the linker molecules.

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