Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 22, 2019
Patent Application Number
14332757
Date Filed
July 16, 2014
Patent Citations
Patent Citations Received
0
Patent Primary Examiner
Patent abstract
An example system includes a circuit board having electrical elements; a wafer having contacts; and an interconnect to route signals between the electrical elements and the contacts. The interconnect includes multiple layers, each of which includes a flexible circuit. The flexible circuit includes a conductive trace disposed thereon. The interconnect also includes shielding between adjacent layers of the multiple layers. The shielding is electrically connected to ground.
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