US Patent 10453804 Radio die package with backside conductive plate
Patent 10453804 was granted and assigned to Intel on October, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 19, 2015
0
Date of Patent
October 22, 2019
0
Patent Applicant
Patent Application Number
14909939
0
Patent Citations Received
Patent Inventor Names
Thorsten Meyer
0
Telesphor Kamgaing
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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