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US Patent 10455726 Modular cooling

Patent 10455726 was granted and assigned to Hewlett Packard Enterprise on October, 2019 by the United States Patent and Trademark Office.

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Patent abstract

A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

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Patent Inventor Names
David Allen Moore0
Douglas Kent Garday0
John P Franz0
Tahir Cader0
Wade D Vinson0
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Patent Citations Received
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US Patent 11758682 Distributed infrastructure and mobile architecture for edge computing
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=10455726
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https://pdfpiw.uspto.gov/.piw?Docid=10455726
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Patent citations received
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US Patent 11297739 IT enclosure system and in-series configuration
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Patent citations received
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US Patent 11284542 Modular two-dimensional cooling system design
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 US Patent 10455726 Modular cooling

Infobox
Is a
Patent
Patent
Patent applicant
Hewlett Packard Enterprise
Hewlett Packard Enterprise
Current assignee
Hewlett Packard Enterprise
Hewlett Packard Enterprise
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10455726
Date of patent
October 22, 2019
Patent application number
15511983
Date Filed
September 30, 2014
Patent primary examiner
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Anthony M Haughton

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