US Patent 10459159 Photonic package and method forming same
Patent 10459159 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 22, 2019
0
Date of Patent
October 29, 2019
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Patent Applicant
Patent Application Number
16390565
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Patent Citations
Patent Inventor Names
Yushun Lin
0
Sung-Hui Huang
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Tien-Yu Huang
0
Wen-Cheng Chen
0
Jui Hsieh Lai
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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