Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 29, 2019
Patent Application Number
15660227
Date Filed
July 26, 2017
Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.
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