Patent attributes
A laser-guided cutting assembly for severing objects includes a work surface. A severing implement is operationally coupled to the work surface. The severing implement comprises at least one blade that is configured to cut an object that is positioned on the work surface. A display and a measurer are coupled to the work surface. The measurer is laser-enabled and is operationally coupled to the display. The measurer is configured to measure a first distance between the measurer and the blade, and to measure a second distance between the measurer and an end of the object that is positioned between the blade and the measurer. A portion of the object that is positioned between the blade and the measurer has a severable length equal to the first distance minus the second distance. The display is configured to report to a user the severable length of the object.
