Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 5, 2019
Patent Application Number
15980676
Date Filed
May 15, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A 3DIC structure includes a first die and a second die on a substrate and a bonding die. The boding die is electrically bonded to the first die and the second die. The bonding die covers a portion of a top surface of a scribe region between the first die and the second die.
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