US Patent 10475654 Wrap-around contact plug and method manufacturing same
Patent 10475654 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 31, 2017
Date of Patent
November 12, 2019
Patent Applicant
Patent Application Number
15691871
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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