US Patent 10477670 Flexible circuit board assembly for LED lamp
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Patent abstract
A flexible circuit board assembly for an LED lamp of the present disclosure comprises: a resin layer having a strip shape; a conductive signal line layer formed from a predetermined pattern provided on the upper part of the resin layer; and a radiation layer provided on the lower part of the resin layer, having a thickness relatively thicker than that of the conductive signal line layer, and radiating the heat generated from an LED mounted on the signal line layer, wherein the signal line layer and the radiation layer are made from one material from among copper, aluminum, copper alloy and an aluminum alloy.
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Patent Inventor Names
Hwang Ryong Kim0
Jeong Wook Hur0
Young Min Yoon0
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Patent Jurisdiction
Patent Number
104776700
Date of Patent
November 12, 2019
0Patent Application Number
155566270
Date Filed
March 9, 2016
0Patent Citations Received
Patent Primary Examiner
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US Patent 10477670 Flexible circuit board assembly for LED lamp
Infobox
Is a
Patent jurisdiction
Patent number
10477670
Date of patent
November 12, 2019
Patent application number
15556627
Date Filed
March 9, 2016
Patent primary examiner
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