Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 19, 2019
Patent Application Number
15184380
Date Filed
June 16, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic component device includes: a wiring board including an insulating layer, and a plurality of pads exposed from the insulating layer; an electronic component module including: an insulating base material; an electronic component embedded in the insulating base material; and a plurality of connection terminals each connected to a corresponding one of the pads; and a sealing resin provided between the whole of a lower surface of the electronic component module id the wiring board. A content rate of filler contained in the sealing resin is higher than that of filler contained in the insulating layer and that of filler contained in the insulating base material.
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