Patent attributes
Thermal management devices for a computing device are described herein. A thermal management device includes a layer of a first material included in a dynamic portion of the thermal management device and a static portion of the thermal management device. The dynamic portion of the thermal management device is bendable relative to the static portion of the thermal management device when the thermal management device is physically connected to a display and a chassis of the computing device, and the display rotates relative to a chassis. The layer of material has a first side and a second side. The second side is opposite the first side. The thermal management device also includes a first layer of a second material and a second layer of the second material physically connected to the first side and the second side of the static portion of the layer of the first material, respectively.