Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 26, 2019
Patent Application Number
16016656
Date Filed
June 25, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes an integrated circuit (IC), a heat dissipation structure, a molding layer and an antenna. The IC is mounted on a first surface of a first redistribution layer (RDL). The heat dissipation structure is mounted on a second surface of the first RDL. The molding compound is disposed over the first surface of the first RDL. The antenna is disposed on the second surface of the first RDL, wherein the antenna is disposed side-by-side to the heat dissipation structure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
