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US Patent 10490528 Embedded wire bond wires

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 12, 2016
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Date of Patent
November 26, 2019
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Patent Application Number
14993586
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Patent Citations Received
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US Patent 12075734 Volumetric budget based irrigation control
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US Patent 10854577 3D die stacking structure with fine pitches
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US Patent 11581287 Chip scale thin 3D die stacked package
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US Patent 10999983 Volumetric budget based irrigation control
0
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US Patent 11404338 Fine pitch bva using reconstituted wafer with area array accessible for testing
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US Patent 11424211 Package-on-package assembly with wire bonds to encapsulation surface
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US Patent 11477950 Volumetric budget based irrigation control
Patent Inventor Names
Willmar Subido
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Abiola Awujoola
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Ashok S. Prabhu
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Wael Zohni
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
10490528
0
Patent Primary Examiner
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Allen L Parker
0

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