Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takahiko Kiso0
Nobuyuki Kurashima0
Date of Patent
December 3, 2019
Patent Application Number
16202626
Date Filed
November 28, 2018
Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.
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