Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 3, 2019
Patent Application Number
15222815
Date Filed
July 28, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a first molding layer; a second molding layer formed over the first molding layer; a first conductive coil including a first portion continuously formed in the first molding layer and a second portion continuously formed in the second molding layer, wherein the first and the second portions are laterally displaced from each other; and a second conductive coil formed in the second molding layer, wherein the second conductive coil is interweaved with the second portion of the first conductive coil in the second molding layer.
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