Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ga Hyun No0
Yong Kuk Kim0
Kyung Hwan Cho0
Jin Kyoung Park0
Date of Patent
December 3, 2019
Patent Application Number
16058549
Date Filed
August 8, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package may include a first chip stack, a second chip stack, and a third chip stack. The third chip stack may include third semiconductor chips, the third chip stack coupled to both of the first and second chip stacks.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.