US Patent 10499544 Thermal energy dissipation systems and methods

A system includes a housing (105) or enclosure for electrical components. The housing can include a base (106) and a lid (107) pivotably coupled to the base by one or more hinges (108,109). One or more heat-generating electrical components situated within the housing. One or more heat transfer devices (301,302,303,304) couple the housing to a thermal energy sink (207). The heat transfer devices transfer thermal energy generated by the one or more heat-generating electrical components from the housing to the thermal energy sink, thereby increasing the thermal dissipation capability of the housing.