Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wei Jun Wang0
Ling Shen0
Liqiang Zhang0
Ya Qun Liu0
Haigang Kang0
Huifeng Duan0
Kai Zhang0
Date of Patent
December 10, 2019
0Patent Application Number
156420820
Date Filed
July 5, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
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