US Patent 10504827 Semiconductor device and manufacturing method thereof
Patent 10504827 was granted and assigned to Amkor Technology on December, 2019 by the United States Patent and Trademark Office.
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Patent abstract
An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.
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Patent Inventor Names
Bora Baloglu0
Curtis Zwenger0
Ron Huemoeller0
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US Patent 10504827 Semiconductor device and manufacturing method thereof
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10504827
Date of patent
December 10, 2019
Patent application number
15173116
Date Filed
June 3, 2016
Patent primary examiner
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