US Patent 10504879 Light-emitting component and method for producing a light-emitting component

The invention relates to a component with at least one optoelectronic semiconductor chip, comprising: a connection substrate, which has an assembly surface and electric contact structures, and a plurality of structured semiconductor units, each of which has a plurality of monolithically connected pixels with a respective active layer that emits light during operation, wherein: the semiconductor units are arranged at a lateral distance to one another on the assembly surface, the distance between adjacent semiconductor units is at least 5 μm and maximally 55 μm, and the pixels can be controlled in an electrically separated manner. The invention also relates to a method for producing said component.