Patent attributes
Apparatus and methods for synchronization of multiple semiconductor dies are provided herein. In certain implementations, a reference clock signal is distributed to two or more semiconductor dies that each include at least one data converter. The two or more dies include a master die that generates a data converter synchronization signal, and at least one slave die that processes the data converter synchronization signal to align timing of data conversion operations across the dies, for instance, to obtain a high degree of timing coherence for digital sampling. In certain implementations, the dies correspond to radar chips of a radar system, and the data converter synchronization signal corresponds to an analog-to-digital converter (ADC) synchronization signal. Additionally, the master radar chip generates a ramp synchronization signal to synchronize transmission sequencing across the radar chips and/or to provide phase alignment of ADC clock signals.
