US Patent 10510710 Bump-on-trace interconnect
Patent 10510710 was granted and assigned to Taiwan Semiconductor Manufacturing Company on December, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 4, 2018
0
Date of Patent
December 17, 2019
0
Patent Applicant
Patent Application Number
15997124
0
Patent Citations Received
Patent Inventor Names
Chen-Shien Chen
0
Chen-Hua Yu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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