The invention relates to a solderable electric connection element including a crimping portion for receiving a connection cable and a soldering portion for bonding to the surface of an electrically conductive structure. The soldering portion directly adjoins the crimping portion or is offset therefrom by means of a transition portion, and a solder deposit is provided or can be placed on the solder region. According to the invention, an angled section is formed in the section between the crimping and soldering region or in the transition region such that the crimping and soldering region are arranged in a back-to-back position, wherein the free face of the soldering region receives the solder deposit.