Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 24, 2019
Patent Application Number
15401923
Date Filed
January 9, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
A process for manufacturing a semiconductor device and the resulting structure are presented. In an embodiment a source/drain region is grown. Once grown, the source/drain region is reshaped in order to remove facets. The reshaping may be performed using an etching process whereby a lateral etch rate of the source/drain region is larger than a vertical etch rate of the source/drain region.
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