Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wei-Chung Hsiao0
Date of Patent
December 24, 2019
Patent Application Number
15917539
Date Filed
March 9, 2018
Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
A bendable heat plate is provided. The heat plate includes a housing, a micro-structural layer and a fluid. The housing has an inner surface and an enclosed internal space, and includes a bendable section provided with a channel maintaining structure. The micro-structural layer is formed on the inner surface of the housing. The fluid is filled in the internal space. Using the channel maintaining structure, the bendable section is provided with sufficient space for the fluid to pass through.
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