Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yang Choo Chua0
Haiyan Chen0
Date of Patent
December 31, 2019
Patent Application Number
15120690
Date Filed
February 24, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix, boron nitride, and a laser direct structuring additive dispersed in the matrix. The compound can be extruded, molded, calendered, thermoformed, or 3D-printed into a heat dissipating and laser direct structured article.
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