Patent attributes
A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, an IC test system is provide that includes a robot, an input queuing station, an output queuing station, and a test station. The test station includes a first and second test interfaces. The first test interface is configurable to receive and communicatively connect with a first chip package assembly having one arrangement of solder ball connections. The second test interface is configurable to receive and communicatively connect with a second chip package assembly having a different arrangement of solder ball connections. The test station also includes a first test processor configured to test the chip package assembly connected through the first interface utilizing a predetermined first test routine and a second test processor configured to test the chip package assembly connected through the second interface utilizing a predetermined second test routine.
