US Patent 10522664 Electronic device including a tunnel layer
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Patent abstract
An electronic device includes a semiconductor layer, a tunneling layer formed of a material including a two-dimensional (2D) material so as to directly contact a certain region of the semiconductor layer, and a metal layer formed on the tunneling layer.
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Patent Citations Received
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Patent Inventor Names
Hyeonjin Shin0
Hyunjae Song0
Jaeho Lee0
Jisoo Kyoung0
Kyungeun Byun0
Seongjun Park0
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US Patent 10522664 Electronic device including a tunnel layer
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Is a
Patent jurisdiction
Patent number
10522664
Date of patent
December 31, 2019
Patent application number
15904967
Date Filed
February 26, 2018
Patent primary examiner
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