US Patent 10522895 Microwave antenna apparatus, packing and manufacturing method

A microwave antenna apparatus includes: a redistribution layer including a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer; a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line; a mold layer that covers the semiconductor element and the first surface of the carrier layer; and a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide. Further, integrated antennas and transitions are presented within eWLB packages.