Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Szu-Wei Lu0
Chih-Wei Wu0
Jing-Cheng Lin0
Pu Wang0
Ying-Ching Shih0
Chen-Hua Yu0
Chi-Hsi Wu0
Date of Patent
January 7, 2020
0Patent Application Number
156752880
Date Filed
August 11, 2017
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side of the interposer using second electrical connectors, attaching a first dummy die to the first side of the interposer adjacent the second die, encapsulating the first die, the second die, and the first dummy die with an encapsulant, and singulating the interposer and the first dummy die to form a package structure.
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