Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 7, 2020
Patent Application Number
15463500
Date Filed
March 20, 2017
Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit device includes a substrate and a magnetic tunneling junction (MTJ). The MTJ includes at least a pinned layer, a barrier layer, and a free layer. The MTJ is formed over a surface of the substrate. Of the pinned layer, the barrier layer, and the free layer, the free layer is formed first and is closest to the surface. This enables a spacer to be formed over a perimeter region of the free layer prior to etching the free layer. Any damage to the free layer that results from etching or other free layer edge-defining process is kept at a distance from the tunneling junction by the spacer.
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